DiMAC Digital Microscope Software System

Software Features Overview

Basic Features

  • ✓ Basic Measurement
  • ✓ Smart Report
  • ✓ EFI
  • ✓ MIA

Advanced Features

  • ✓ IMC
  • ✓ Penetration Inspection
  • ✓ Particle Statistics
  • ✓ Fiber Statistics

Hardware Compatibility

Supported Camera Systems

Supports cameras from one million pixels to scientific camera. Compatible Cameras

Core Technologies

Image Acquisition

  • ✓ Single field Image
  • ✓ Multiple Image Alignment(MIA)
  • ✓ Extensible Firmware Interface(EFI) Image Acquisition

Automated Extended Focus Imaging (EFI)

EFI technology automatically combines multiple images taken at different focus depths to create a single fully-focused image, perfect for specimens with varying surface heights.

EFI Technology

Automated Multiple Image Alignment (MIA)

MIA technology automatically stitches together multiple images to create a panoramic view of specimens larger than a single field of view.

MIA Technology

Image Gallary

  • ✓ Unique image database function, allowing real-time measurements to be taken and then photographed and saved.
  • ✓ According to the user’s habit of use of self-operation, strong flexibility Image Gallary

Measurement Capabilities

Comprehensive Measurement Tools

  • ✓ Rich collection of measurement tools
  • ✓ PCB industry-specific measurement tools
  • ✓ Customizable measurement functions
  • ✓ Specialized automatic line measurement
Measurement Tool 1 Measurement Tool 2 Measurement Tool 3 Measurement Tool 4

Intelligent Reporting System

  • ✓ Three conventional output methods
  • ✓ One key multi-graph and multi-data exporting
  • ✓ Intelligent automatic data export function

Specialized Analysis Modules

Particle Counting and Classification

Advanced algorithms automatically identify, count, and classify particles based on size, shape, and other parameters.

Particle Analysis 1 Particle Analysis 2 Particle Analysis 3
Analysis Example 1Analysis Example 2
Size Distribution AnalysisShape Classification

Semiconductor IMC Measurements

Specialized module for analyzing Intermetallic Compound (IMC) layer bonding area as a percentage of pads, critical for semiconductor quality control.

IMC Measurement

Penetration Inspection

  • ✓ Exclusive Measurement Tools
  • ✓ Rich Auxiliary Line
  • ✓ Professional Report
WPM Software Interface Melt Analysis Inspection Results

Series version

Series version

Note: The module can be used in combination with the main body according to customer needs. Special reminder: the module cannot be used alone.

Request a Trial